Wafer Wax Application Device "LTP-250"
Improvement of work parallelism! It is possible to de-bubble air and other contaminants that were mixed in during wafer attachment.
The "LTP-250" is a product that allows for vacuum degassing during wax application. It enables the uniformity and thinning of the wax film. By applying the wax in a vacuum state, it is possible to degas bubbles contained in the wax and air that may have been trapped during the application of warped wafers. 【Effects of the application process】 ■ Improved parallelism of the workpiece ■ Enhanced flatness of the polished surface ■ Uniformity of the wax film thickness ■ Thinning of the film ■ Improvement of film distortion *For more details, please refer to the PDF document or feel free to contact us.
- Company：ラップジャパン
- Price：Other
